Appeared on TENAA, the Meizu 16X Design and Specifications Are Total Surgery

Posted on

Beginning in August 2018,  Meizu has officially released Meizu 16 . At the same time, Meizu also launched Meizu 16 Plus. Both are priced at fairly high prices because inside it has been embedded in Qualcomm’s high-class chipset, the Snapdragon 845 .

Related to that, Meizu CEO also once said that Meizu will introduce the Meizu 16 series which is more affordable in terms of price. Therefore, he also added that the upcoming smartphone will be supported by the Snapdragon 710chipset .

Called the Meizu 16X , this smartphone has also appeared on TENAA with the M872Q model number. Not only showing the front and rear, TENAA also revealed some important specifications embedded in this smartphone.

Supported by the Snapdragon 710 chipset which has a 2.2 GHz clock speed, this smartphone also has a design that doesn’t change much compared to the Meizu 16 and Meizu 16 Plus. This smartphone is packed with a 6 inch FullHD +AMOLED screen .

Meizu is also reluctant to pack this smartphone with a notch bangs screen. Therefore it is clear that this smartphone has a straight bezel at the top. Not only that, the lower, left and right bezel is also made thinner or bezel-less.

The embedded SoC is said to be paired with 6 GB of RAM . There is also 64 GB of internal storage support . It’s just that, Meizu doesn’t insert a microSD slot so users have to be satisfied with the available storage capacity.

On the back of a dual-camera that has a 20 MP + 12 MP configuration . As for the front, Meizu includes a selfie-camera with a resolution of 20 MP . For its power supply, this smartphone has been equipped with a 3,000 mAh battery .

Meizu 16X which has dimensions of 151.2 x 73.6 x 7.5 mm and weighs 154 grams will run with the Android Oreo operating system. The colors offered are very diverse, such as Matte Black, Ceramic White, and Frosted Gold . It’s just that the price and availability are still mysterious.

Leave a Reply

Your email address will not be published. Required fields are marked *